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What is Flex Plus One Stop FPC Fabrication Customized Flex PCB Printed Circuit Board

Name: Flex Plus One Stop FPC Fabrication Customized Flex PCB Printed Circuit Board
Uploaded: 2024-05-15T14:22:22+08:00
Description: ABOUT US Established in 2004, Flex Plus (Xiamen) Co., Ltd. is dedicated in high-quality & cost effective flexible printed circuit board (Flex PCB) R&D, manufacturing and sales. To effectively respo

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Price

Min. Order Reference FOB Price

1 Piece US$0.08-10.00 / Piece

Sepcifications

Structure Single-Sided Rigid PCB
Dielectric FR-4
Material Copper
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Flex Plus
Transport Package Vacuum Package with Foam Protection & Carton
Specification Customized
Trademark Flex Plus
Origin China
Copper Thickness Max 5oz
Length Max. 4m (XL Exposure Machine)
Line Width Min 0.05mm
Color Yellow
Sample Delivery 3~5days
MP Delivery 7~10days

Product Description

ABOUT US Established in 2004, Flex Plus (Xiamen) Co., Ltd. is dedicated in high-quality &cost effective flexible printed circuit board (Flex PCB) R&D, manufacturing and sales. To effectively respond to the technological expectations of its customers and satisfy the different market needs, Flex ...

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Flex Plus(Xiamen) Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products Flexible PCB, HDI FPC, Rigid Flex PCB, FFC/FPC Connector, LED Strip Flex Pcbs, Automotive Flex Circuit Board, Dual-Access FPC, TPU Printed Circuits, SMT SMD, PCBA
Registered Capital 10000000 RMB
Plant Area 8000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

FPCB Comparison

	Flex Plus One Stop FPC Fabrication Customized Flex PCB Printed Circuit Board Contact Now	Quick View Automobile Sensors High Density Interconnect HDI PCB 4layer It158 Enig Contact Now	Quick View 6L/8layer High Density Interconnect HDI PCB for Automobile Data Recorder Contact Now	Quick View Multilayer 8layer HDI PCB Shengyi S1000h Enig for Automobile GPS Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now

Transaction Info
	Flex Plus One Stop FPC Fabrication Customized Flex PCB Printed Circuit Board Contact Now	Quick View Automobile Sensors High Density Interconnect HDI PCB 4layer It158 Enig Contact Now	Quick View 6L/8layer High Density Interconnect HDI PCB for Automobile Data Recorder Contact Now	Quick View Multilayer 8layer HDI PCB Shengyi S1000h Enig for Automobile GPS Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now
Price	US $ 0.08-10.00/ Piece	US $ 0.55-3.69/ Piece	US $ 2.12-9.37/ Piece	US $ 1.95-8.83/ Piece	US $ 1.05-7.63/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Single-Sided Rigid PCB; Dielectric: FR-4; Material: Copper; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Flex Plus; Copper Thickness: Max 5oz; Length: Max. 4m (XL Exposure Machine); Line Width: Min 0.05mm; Color: Yellow; Sample Delivery: 3~5days; MP Delivery: 7~10days;	Structure: HDI PCB; Dielectric: Fr4 It158 0.8mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 4layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: Fr4 Em825 1.2mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer - 8layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Unit Size: 242mm X 165mm;	Structure: HDI PCB; Dielectric: Fr4 Em825 1.2mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Other: Resin Plugged;	Structure: Fr4 Shengyi Material; Dielectric: Fr4 S1000h 2.0mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Min. Hole Wall Cu: 25um;
Supplier Name	Flex Plus(Xiamen) Co., Ltd	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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