| Specification |
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Application: Pricise Equipment, PC Board, IC, CD Driver;
Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset;
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
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Application: PC Board, IC, CD Driver, HD Pack;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Open Top, Zip Lock;
Making Process: Composite Packaging Bag;
Raw Materials: APET/PE APET/CPP;
Bag Variety: Open Top Bag, Zip Lock Bag;
Function: Anti Static;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Semi-Transparent;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock;
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Application: Food, Promotion;
Feature: Moisture Proof, Disposable;
Material: Laminated Material;
Shape: with Gusset Side;
Making Process: Composite Packaging Bag;
Raw Materials: Aluminium Foil Paper;
Bag Variety: Your Bag;
Printing: Flexo Printing;
Colors: 5 Colors;
Design: Customized;
MOQ: 50000 PCS;
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Application: Food, Promotion, Household;
Feature: Moisture Proof, Recyclable, Bio-Degradable, Disposable, Shock Resistance;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Customized;
Bag Variety: Your Bag;
MOQ: 20000 Bags;
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