Shenzhen Manufacturing Computer Smart Phone Main Board Customized 4 Layers Irregular Circuit Board Multilayer PCB Video

Name: Shenzhen Manufacturing Computer Smart Phone Main Board Customized 4 Layers Irregular Circuit Board Multilayer PCB
Uploaded: 2023-07-20T16:05:42+08:00
Description: Rigid RoHS Custom Fr4 Multilayer Electronic Circuit Board PCB Manufacturer in China with Competitive Price Company Brief Introduction Abis Circuits Co. Ltd, established in 2006, is Located in Sh

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Price

Min. Order Reference FOB Price

1 Piece US$0.0001-99.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 80mm*120mm
Origin Shenzhen, China
Layers 4 Layers
Solder Mask Green
Legend Write
Surface Finish HASL Lf
Thickness 1.6mm

Product Description

Rigid RoHS Custom Fr4 Multilayer Electronic Circuit Board PCB Manufacturer in China with Competitive Price Company Brief Introduction Abis Circuits Co. Ltd, established in 2006, is Located in Shenzhen, company has about 1100 workers and two PCB workshops with about 50000 square meters. ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

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Transaction Info
	Quick View Shenzhen Manufacturing Computer Smart Phone Main Board Customized 4 Layers Irregular Circuit Board Multilayer PCB Contact Now	Quick View Customized Oversize FPC Coverlay Pi Plus adhesive Stiffener Rigid-Flex PCB Board Manufacturer Contact Now	Quick View Customized FPC Coverlay with Pi Plus Adhesive/Steel Stiffener Flexible PCB Board Manufacturer Contact Now	Quick View Coverlay Polyimide Plus adhesive Steel/Pi Stiffener HDI Rigid-Flex PCB Board Manufacturer Contact Now	Quick View Coverlay Polyimide Plus adhesive Steel/Stiffener Blind Buried Vias Rigid-Flex PCB Board Manufacturer Contact Now
Price	US $ 0.0001-99.00/ Piece	US $ 1.00-7.80/ pcs	US $ 0.90-2.80/ pcs	US $ 1.20-7.80/ pcs	US $ 1.90-8.10/ pcs
Min Order	1 Pieces	1 pcs	1 pcs	1 pcs	1 pcs
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, Paypal	L/C, T/T, Paypal	L/C, T/T, Paypal	L/C, T/T, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 4 Layers; Solder Mask: Green; Legend: Write; Surface Finish: HASL Lf; Thickness: 1.6mm;	Type: Rigid-Flex Board; Dielectric: Fr4+Pi; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Hspcb; Customized: Yes;	Type: Flexible Circuit Board; Dielectric: Pi; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Pi; Insulation Materials: Epoxy Resin; Brand: Hspcb; Customized: Yes;	Type: Rigid-Flex Board; Dielectric: Fr4+Pi; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Hspcb; Customized: Yes;	Type: Rigid-Flex Board; Dielectric: Fr4+Pi; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Hspcb; Customized: Yes;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Hesheng Circuit Technology Limited	Shenzhen Hesheng Circuit Technology Limited	Shenzhen Hesheng Circuit Technology Limited	Shenzhen Hesheng Circuit Technology Limited
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