Flex-Rigid PCB
US$0.01-100.00 / Piece
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What is China High Professional Rigid-Flex PCB Board Fr4+Pi/Polyimide PCB Printed Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Consumer Electronics
  • Transport Package Vacuum Packing
  • Specification 560*12 mm
  • Trademark Abis
  • Origin Shenzhen, China
  • Layer 1-2 Layers
  • Common Finish Board Thickness 0.3-5mm
  • Raw Material Aluminum Base, Copper Base
  • Min Line Width/Space 3mil(0.075mm)
  • Impedance Control Tolerance +/-10%
  • Solder Mask/Silkscreen Custom

Product Description

China High Professional Rigid-Flex PCB board FR4+PI/Polyimide PCB Printed Circuit Board Technical &Capability Item Speci. Layers 1~8 Board Thickness 0.1mm-0.2mm Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz) Constantan ...

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Flex-Rigid PCB Comparison
Transaction Info
Price US $ 0.01-100.00/ Piece US $ 0.44/ Piece US $ 0.46/ Piece US $ 0.34/ Piece US $ 0.35/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Aviation and Aerospace;
Final Height of PCB: 1.6mm;
Final Foil External: 35 Um;
Surface Finish: Immersion Gold;
Coverlay Colour: Yellow Coverlayer / Green Solder Mask;
Color of Silkscreen: White;
RoHS Required: Yes;
Function: 100% Pass Electrical Test;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Aviation and Aerospace;
Final Height of PCB: 1.0mm;
Surface Cu Thickness: 35 µm;
Inner Iayer Cu Thicknes: 35 µm;
Surface Finish: Immersion Gold;
Coverlay Colour: Yellow Coverlayer / Green Solder Mask;
Color of Silkscreen: White;
RoHS Required: Yes;
Function: 100% Pass Electrical Test;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Mobile Phone, Aviation and Aerospace;
Final Height of PCB: 0.20mm;
Final Foil External: 35 µm;
Surface Finish: Immersion Gold;
Coverlay Colour: Yellow Coverlay / Green Solder Mask;
Color of Silkscreen: White;
RoHS Required: Yes;
Function: 100% Pass Electrical Test;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Mobile Phone, Aviation and Aerospace;
Final Height of PCB: 0.20mm;
Final Foil External: 35 µm;
Surface Finish: Immersion Gold;
Coverlay Colour: Yellow;
Color of Silkscreen: White;
RoHS Required: Yes;
Function: 100% Pass Electrical Test;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier