Multilayer Flexible Pcbs 4 Layer Rigid-Flex Pcbs with 1.6mm Fr4 &0.2mm Polyimide Pcbs

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.44 / Piece

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Digital Products, Aviation and Aerospace
  • Transport Package Transparent Bags
  • Specification 60.22 X 132.27mm= 1 PCS
  • Trademark Bicheng Enterprise Limited
  • Origin China
  • Final Height of PCB 1.6mm
  • Final Foil External 35 Um
  • Surface Finish Immersion Gold
  • Coverlay Colour Yellow Coverlayer / Green Solder Mask
  • Color of Silkscreen White
  • RoHS Required Yes
  • Function 100% Pass Electrical Test
  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Conductive Adhesive Conductive Silver Paste
  • Processing Technology Electrolytic Foil
  • Base Material Copper

Product Description

1.1 General description This is a type of rigid flex PCB for the application of Portable Sound Systems. It's a 4 layer PCB with flexible part in the middle. The base laminate is from Shengyi, It's fabricated per IPC 6012 Class 2 using supplied Gerber data. 1.2 Features and benifits A. ...

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Transaction Info
Price US $ 0.44/ Piece US $ 0.01-10.00/ Piece US $ 0.01-100.00/ Piece US $ 0.10-80.00/ Piece US $ 2.50-5.50/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification - - - UL, ISO9001&ISO14001, SGS, RoHS,Ts16949 -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$10 Million - US$50 Million
Business Model OEM, Own Brand(Bicheng) OEM OEM OEM OEM, ODM, Own Brand(KMC)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Aviation and Aerospace;
Final Height of PCB: 1.6mm;
Final Foil External: 35 Um;
Surface Finish: Immersion Gold;
Coverlay Colour: Yellow Coverlayer / Green Solder Mask;
Color of Silkscreen: White;
RoHS Required: Yes;
Function: 100% Pass Electrical Test;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Industry Area;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Surface Finishing: Lead Free HASL, Immersion Gold(Enig), Immersion SL;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Special Process: Stiffeners etc;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Brand: Abis;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V2;
Application: Consumer Electronics;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier