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What is Professional Customized High Tg Multilayer Circuit Enig PCB

Name: Professional Customized High Tg Multilayer Circuit Enig PCB
Uploaded: 2023-07-27T10:27:23+08:00
Description: Wholesale Multilayer Printed Circuit Board Tg150, Tg170, Tg180, Customized High Tg PCB Board Technical & Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 240*200
Trademark ABIS CIRCUITS CO., LTD
Origin Shenzhen, China
Board Thickness 0.20mm-8.00mm
Outercopper Thickness 18um--350um
Intercopper Thickness 17um--175um
Surface Finish HASL-Lf
Solder Mask Green or as Your Requirement
Legend White or as Your Requirement

Product Description

Wholesale Multilayer Printed Circuit Board Tg150, Tg170, Tg180, Customized High Tg PCB Board Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Board Comparison

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Transaction Info
	Quick View Professional Customized High Tg Multilayer Circuit Enig PCB Contact Now	Quick View High Quality Multi Layer PCB with Enig Finishment Multilayer PCB Contact Now	Quick View Shenzhen Factory Made Competitive Price PCB Contact Now	Quick View Turnkey PCB Prototyping Mini BGA Board Mobile Phone Motherboard for Consumer Electronics Contact Now	Quick View High Quality Multilayer Flexible Fr4 Manufacturer Rigid-Flex PCB Contact Now
Price	US $ 0.01-100.00/ Piece	US $ 0.10-15.00/ Piece	US $ 0.10-10.00/ Piece	US $ 2.60-20.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM	OEM	-	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 0.20mm-8.00mm; Outercopper Thickness: 18um--350um; Intercopper Thickness: 17um--175um; Surface Finish: HASL-Lf; Solder Mask: Green or as Your Requirement; Legend: White or as Your Requirement;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: EEG;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Exceeding Electronics;	Type: Rigid Circuit Board; Material: Fr4; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Hl-PCB; Surface Treatment: Immersion Gold; Mini Hole Diameter: 0.3mm; Borad Thickness: 0.1mm; Count Layer: 4; Inner/Outer Copper Thickness: 1oz/1oz; Min Trace Width/Spacing: 5mil/5mil; Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.; Special: Mini BGA;	Type: Flexible Circuit Board; Dielectric: No; Material: Polyimide; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: No; Brand: Exceeding Electronics;
Supplier Name	Abis Circuits Co., Ltd.	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen Honglian Circuit Co., Ltd.	EXCEEDING ELECTRONICS GROUP LIMITED
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