Circuit Board

US$0.01-100.00 / Piece

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What is Immersion Gold Multilayer PCB Customized Electronic Printed Circuit Board

Name: Immersion Gold Multilayer PCB Customized Electronic Printed Circuit Board
Uploaded: 2023-08-18T15:17:42+08:00
Description: Immersion Gold Multilayer PCB Customized Electronic Printed Circuit Board 1. Single,Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole,Screw Hole(Counter bore),Press

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kingboard
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Enig Thickness 1-3u′′
Board Thickness 0.2-6mm
Hard Gold Thickness 1-50u′′
Layers 1-20layers
Copper Thickness 0.5-8oz
Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949

Product Description

Immersion Gold Multilayer PCB Customized Electronic Printed Circuit Board 1. Single,Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole,Screw Hole(Counter bore),Press fit,Half Hole. 3. HASL lead free, Immersion Gold/ Silver/Tin, OSP,gold ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Circuit Board Comparison

	Immersion Gold Multilayer PCB Customized Electronic Printed Circuit Board Contact Now	Immersion Silver PCB on 0.4mm Fr-4 with 4 Layer Copper Contact Now	4 Layer PCB Prototype with 2 Layout Designs in One Panel Contact Now	Immersoin Gold PCB on 4 Layer Copper with Blind Via Contact Now	4 Layer PCB Fr-4 Iteq Base Material Taiyo Ink Contact Now

Transaction Info
	Immersion Gold Multilayer PCB Customized Electronic Printed Circuit Board Contact Now	Immersion Silver PCB on 0.4mm Fr-4 with 4 Layer Copper Contact Now	4 Layer PCB Prototype with 2 Layout Designs in One Panel Contact Now	Immersoin Gold PCB on 4 Layer Copper with Blind Via Contact Now	4 Layer PCB Fr-4 Iteq Base Material Taiyo Ink Contact Now
Price	US $ 0.01-100.00/ Piece	US $ 0.35/ Piece	US $ 0.38/ Piece	US $ 0.40/ Piece	US $ 0.37/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS, IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kingboard; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Board Thickness: 0.2-6mm; Hard Gold Thickness: 1-50u''; Layers: 1-20layers; Copper Thickness: 0.5-8oz;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Cu Thickness: 1 Oz; Final Foil Internal: 0.5 Oz; Final Height of PCB: 1.6mm ±0.16; Surface Finish: Immersion Silver, AG>0.15µm; Solder Mask Color: Green; Colour of Component Legend: White; Minimum Trace and Space: 6.99 Mil/8.47 Mil; Minimum / Maximum Holes: 0.399mm/3.556mm; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Cu Thickness: 1 Oz; Final Foil Internal: 0.5 Oz; Final Height of PCB: 1.6mm ±0.16; Surface Finish: Hot Air Soldering Leveling(HASL),Lead Free; Solder Mask Color: Green; Colour of Component Legend: White; Minimum Trace and Space: 7.87 Mil/6 Mil; Minimum / Maximum Holes: 0.65/3.2mm; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Cu Thickness: 1 Oz; Final Foil Internal: 0.5 Oz; Final Height of PCB: 1.6mm ±0.16; Surface Finish: Immersion Gold; Solder Mask Color: Green; Colour of Component Legend: White; Minimum Trace and Space: 6.7 Mil/5.9 Mil; Minimum / Maximum Holes: 0.3/2.5mm; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Cu Thickness: 1 Oz; Final Foil Internal: 1 Oz; Final Height of PCB: 1.6 mm ±0.16; Surface Finish: Immersion Gold (30.1% ); Solder Mask Color: Green; Colour of Component Legend: White; Minimum Trace and Space: 7.8 Mil / 5 Mil; Minimum / Maximum Holes: 0.2 mm / 3.0 mm; Test: 100% Electrical Test Prior Shipment;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd
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