2022 China Professional SMT Electronic PCB&PCBA Manufacturer PCB Design and Layout Services

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-50.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V1
  • Dielectric FR-4
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Paper Phenolic Copper Foil Substrate
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 130*100mm
  • Trademark ABIS
  • Origin Shenzhen, China
  • Layer 1-40 Layers
  • Raw Material Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.
  • Board Outline Tolerance +0.10mm
  • Impedance Control Tolerance +/-10%

Product Description

2022 China Professional SMT Electronic PCB&PCBA Manufacturer PCB Design and Layout Services Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm ...

Learn More

PCB Board Comparison
Transaction Info
Price US $ 0.01-50.00/ Piece US $ 2.99-3.11/ Piece US $ 2.99-3.11/ Piece US $ 2.99-3.11/ Piece US $ 2.99-3.11/ Piece
Min Order 1 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V1;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Abis;
Layer: 1-40 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Outline Tolerance: +0.10mm;
Impedance Control Tolerance: +/-10%;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Huixian;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Huixian;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Huixian;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Huixian;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhongshan Huishine PCBA.Co.,Ltd

China Supplier - Diamond Member Audited Supplier

Zhongshan Huishine PCBA.Co.,Ltd

China Supplier - Diamond Member Audited Supplier

Zhongshan Huishine PCBA.Co.,Ltd

China Supplier - Diamond Member Audited Supplier

Zhongshan Huishine PCBA.Co.,Ltd

China Supplier - Diamond Member Audited Supplier