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What is Turnkey Solution Service Fr4 PCB Printed Circuit Board Multilayer Enig & HASL PCB Assembly ODM OEM Electronic Board

Name: Turnkey Solution Service Fr4 PCB Printed Circuit Board Multilayer Enig & HASL PCB Assembly ODM OEM Electronic Board
Uploaded: 2023-11-30T18:50:40+08:00
Description: Turnkey Solution Service Fr4 PCB Printed Circuit Board Multilayer Enig & HASL PCB Assembly ODM OEM Electronic Board Abis Circuit Co.,LTD PCB's aim: Customer Satisfaction is A

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL, ISO9001&ISO14001, SGS, RoHS, Ts16949
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 1.6mm
Copper Thickness 0.5-8oz

Product Description

Turnkey Solution Service Fr4 PCB Printed Circuit Board Multilayer Enig &HASL PCB Assembly ODM OEM Electronic Board Abis Circuit Co.,LTD PCB's aim: Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Flexible PCB Comparison

	Turnkey Solution Service Fr4 PCB Printed Circuit Board Multilayer Enig & HASL PCB Assembly ODM OEM Electronic Board Contact Now	Quick Turnaround PCB Prototype on 2.0mm Fr-4 with Black Color Contact Now	Multilayer PCB 2.0mm Thick Fr-4 with Immersion Gold Contact Now	Quick View Electronic Telecontroller Assembly PCB and PCBA Contact Now	Quick View Power Bank PCB and Assembly PCB Board Contact Now

Transaction Info
	Turnkey Solution Service Fr4 PCB Printed Circuit Board Multilayer Enig & HASL PCB Assembly ODM OEM Electronic Board Contact Now	Quick Turnaround PCB Prototype on 2.0mm Fr-4 with Black Color Contact Now	Multilayer PCB 2.0mm Thick Fr-4 with Immersion Gold Contact Now	Quick View Electronic Telecontroller Assembly PCB and PCBA Contact Now	Quick View Power Bank PCB and Assembly PCB Board Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 0.31/ Piece	US $ 0.34/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 1.6mm; Copper Thickness: 0.5-8oz;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Final Foil External: 35 Um; Final Height of PCB: 2.00±10%mm; Surface Finish: Immersion Gold; Solder Mask Color: Black; Colour of Component Legend: White; Mininum Trace (Mil): 5.9 Mil; Minimum Gap(Mil): 48 Mil; Via: Via Tented.; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Final Foil External: 35 Um (1 Oz); Inner Iayer Cu Thicknes: 35 Um (1 Oz); Final Height of PCB: 2.0mm +/-0.2; Surface Finish: Immersion Gold; Solder Mask Color: Green; Colour of Component Legend: White; Mininum Trace (Mil): 7 Mil; Minimum Gap(Mil): 5 Mil; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 1oz; Surface Finishing: Enig; Solder Mask Type: Green; Silkscreen: White; Board Thickness: 1.6mm; Layer: 1 to 18; Min. Hole Size: 0.07mm; Min.Line Width: 0.1mm; Min.Line Spacing: 0.1mm; Finishing: Hal, OSP, Immersion;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 1oz; Surface Finishing: Enig; Solder Mask Type: Green; Silkscreen: White; Board Thickness: 1.6mm; Layer: 1 to 18; Min. Hole Size: 0.07mm; Min.Line Width: 0.1mm; Min.Line Spacing: 0.1mm; Finishing: Hal, OSP, Immersion;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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