Circuit Board

US$0.01-150.00 / Piece

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Lead Free Hal PCB PCBA Air Conditioner with High Quality in China pictures & photos

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What is Lead Free Hal PCB PCBA Air Conditioner with High Quality in China

Name: Lead Free Hal PCB PCBA Air Conditioner with High Quality in China
Uploaded: 2023-07-06T14:04:43+08:00
Description: Lead Free Hal PCB Air Conditioner with High Quality in China 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half H

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Kb
Transport Package Vacuum Package
Specification UL, ISO14001, ISO9001, SGS
Trademark ABIS CIRCUITS
Origin Made in China
Cooper Thickness 1oz
Surface Finishing Lf HASL
Solder Mask Color Green
Silkscreen White
Min Line Width/Space 0.154mm/0.2mm
Min Hole Diameter 0.3mm
Finished Board Thickness 1.6mm
Layer 2 Layer

Product Description

Lead Free Hal PCB Air Conditioner with High Quality in China 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

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Transaction Info
	Quick View Lead Free Hal PCB PCBA Air Conditioner with High Quality in China Contact Now	Quick View China OEM PCBA Control Board PCB Assembly with RoHS Complaint Contact Now	Quick View PCBA Manufacturer Provide SMT Electronic Components PCB Assembly Service Contact Now	Quick View Turnkey Project and PCB Assembly Service for Electronic PCBA Products Contact Now	Quick View Excellent Quality PCB Assembly Service in Shenzhen Contact Now
Price	US $ 0.01-150.00/ Piece	US $ 0.53-5.00/ Piece	US $ 0.32-6.00/ Piece	US $ 0.32-6.00/ Piece	US $ 0.15-12.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Kb; Cooper Thickness: 1oz; Surface Finishing: Lf HASL; Solder Mask Color: Green; Silkscreen: White; Min Line Width/Space: 0.154mm/0.2mm; Min Hole Diameter: 0.3mm; Finished Board Thickness: 1.6mm; Layer: 2 Layer;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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