PCB
US$0.10-50.00 / piece
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What is Multi-Layer PCB Printer Circuit Board with Immersion Gold Immersion Silver Enig PCB Board Assembly with High Quality UL

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 piece US$0.10-50.00 / piece

Sepcifications

  • Structure Double-Sided FPC
  • Material Polyimide
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 240*200
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Shenzhen, China
  • Combination Mode Adhesive Flexible Plate
  • Conductive Adhesive Conductive Silver Paste

Product Description

ABIS CIRCUITS CO., LTD Created in 2006,as a long history China based PCB supplier, ABIS manufactures different kinds of printed circuit boards, including MCPCB,CEM-1,CEM-3,and FR4,FR-4 high Tg, Rogers, Teflon, Arlon ets special material. ABIS has set up two PCB factories in China: one for MCPCB ...

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PCB Comparison
Transaction Info
Price US $ 0.10-50.00/ piece US $ 0.217-0.89/ Piece US $ 0.84-1.13/ Piece US $ 1.22-3.26/ Piece US $ 1.29-3.68/ Piece
Min Order 1 piece 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms T/T, Western Union, Paypal, 30 days net T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided FPC;
Material: Polyimide;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64L;
Board Thickness: >=280 Mils;
Soldermask Color: Black;
Min. Trace/Space: 4mil;
Other: Black Soldermask Bridge;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Security Products;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64L;
Board Thickness: >=280 Mils;
Soldermask Color: Green;
Min. Trace/Space: 3mil;
Min. Hole Size: 8mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Security Products;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 8L/up to 64L;
Board Thickness: >=280 Mils;
Soldermask Color: Green;
Min. Trace/Space: 3mil;
Min. Hole Size: 6mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Security Products;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 8L/up to 64L;
Board Thickness: >=280 Mils;
Soldermask Color: Green;
Min. Trace/Space: 3mil;
Difficulties: Hole to Ring Space 6mil;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier