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US$0.10-0.50 / piece
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What is Smart Electronic PCB Printed Circuit Board for Mobile Phone Motherboard

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 piece US$0.10-0.50 / piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 240*200
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Shenzhen, China
  • Board Thickness 1.6 mm
  • Copper Thickness 35 Um
  • Surface Finish Enig
  • Solder Mask Green
  • Legend White

Product Description

ABIS CIRCUITS CO., LTD Created in 2006,as a long history China based PCB supplier, ABIS manufactures different kinds of printed circuit boards, including MCPCB,CEM-1,CEM-3,and FR4,FR-4 high Tg, Rogers, Teflon, Arlon ets special material. ABIS has set up two PCB factories in China: one for MCPCB ...

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PCB Comparison
Transaction Info
Price US $ 0.10-0.50/ piece US $ 0.90-20.00/ Piece US $ 0.20-5.60/ pcs US $ 1.20-7.80/ pcs US $ 0.30-1.20/ pcs
Min Order 1 piece 1 Pieces 1 pcs 1 pcs 1 pcs
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, 30 days net L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Product Certification - ISO14001, ISO9001, IATF16949, UL, RoHS etc. - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM - OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6 mm;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Solder Mask: Green;
Legend: White;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Enepig Process;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special Process: Enepig Surface Treatment;
Type: Ceramics;
Dielectric: Ceramics;
Material: Ceramics;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Ceramics;
Insulation Materials: Ceramics;
Brand: Hspcb;
Customized: Yes;
Type: Rigid-Flex Board;
Dielectric: Fr4+Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Flexible Circuit Board;
Dielectric: Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: Hspcb;
Customized: Yes;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier