VIP in Pad PCB Built on 26 Layer with Plated Radii (Edge Castellated)

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Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 150 X 800mm
Trademark Bicheng
Origin China

Product Description

General profile With the development of electronic products to light, thin and small, PCBs are also pushed into high density, high difficulty. Among them, via in pad is one of the topics that engineering designer can not avoid. It is a main part of multilayer PCBs and directly helps to save PCB ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

Prototype Comparison

	VIP in Pad PCB Built on 26 Layer with Plated Radii (Edge Castellated) Contact Now	Quick View Specialized Manufacturer PCB Circuit for All Electronic Products Contact Now	High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT338) Contact Now	High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300) Contact Now	Quick View New Material Hydrocarbon Polymer Ceramic Copper Clad Laminates Series Contact Now

Transaction Info
	VIP in Pad PCB Built on 26 Layer with Plated Radii (Edge Castellated) Contact Now	Quick View Specialized Manufacturer PCB Circuit for All Electronic Products Contact Now	High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT338) Contact Now	High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300) Contact Now	Quick View New Material Hydrocarbon Polymer Ceramic Copper Clad Laminates Series Contact Now
Price	US $ 9.99/ Piece	US $ 0.08-0.10/ PCS	Negotiable	Negotiable	Negotiable
Min Order	1 Pieces	1 PCS	1 pcs	1 pcs	1 pcs
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, Western Union	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO,UL,RoHS	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949	ISO 9001, ISO 9000, ISO 13485	ISO 9001, ISO 9000, ISO 13485	ISO 9001, ISO 9000, ISO 13485
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	-	-	-
Annual Export Revenue	US$10 Million - US$50 Million	Above US$100 Million	-	-	-
Business Model	OEM, Own Brand(Bicheng)	OEM	OEM, ODM, Own Brand()	OEM, ODM, Own Brand()	OEM, ODM, Own Brand()
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersional Gold; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Ucreate PCB; Board Thickness: 1.2~2.0mm; Surface Finihsing: Immersional Gold; Lead Time: 6-8 Working Days; PCB Testing: E-Testing; Flying Probe Testing; Mask Ink Color: White/Black/Green/Red/Yellow/Blue; Color: Green Blue Red; Number of Layers: Multilayer; Copper Thickness: 2oz; Condition: Original Made;	Type: Polymer Ceramic Copper; Dielectric: Polymer Ceramic Copper; Material: Copper; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Wl; Dielectric Constant: 3.38±0.05; Size(mm): 610X460, 600X500,915X1220; Dielectric Thickness: 1.016mm; Density(G/ Cm3): 1.78; Moisture Absoption: 0.07;	Type: Polymer Ceramic Copper; Dielectric: Polymer Ceramic Copper; Material: Copper; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Wl; Pimd: Less Than -158dbc; Sample: Available; Dielectric Thickness: 1.034mm; Density(G/ Cm3): 1.57; Dielectric Constant: 3.0±0.05; Type of Copper Foil: RTF Copper Foil;	Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Dielectric Constant: 3.38±0.05; Size(mm): 610X460, 600X500,915X1220; Dielectric Thickness: 0.526-1.542; Density(G/ Cm3): 1.78; Moisture Absoption: 0.07;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Ucreate PCB Co., Ltd.	New Vision Meditec Co., Limited	New Vision Meditec Co., Limited	New Vision Meditec Co., Limited
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