High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300) pictures & photos

High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)

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Price

Min. Order Reference FOB Price

1 pcs Negotiable

Sepcifications

Type Polymer Ceramic Copper
Dielectric Polymer Ceramic Copper
Material Copper
Application Communication
Flame Retardant Properties HB
Mechanical Rigid Fexible
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Wl
Transport Package Standard Export Package
Trademark WL
Origin China
Pimd Less Than -158dbc
Sample Available
Dielectric Thickness 1.034mm
Density(G/ Cm3) 1.57
Dielectric Constant 3.0±0.05
Type of Copper Foil RTF Copper Foil

Product Description

High quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300) Model: WL-CT300 Introduction: WL-CT300 is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset ...

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New Vision Meditec Co., Limited

Gold Member Since 2013

Audited Supplier

Main Products Ophthalmic Diagnosis Equipment, Ophthalmic Instrument, Operation Microscope, Auto Refractometer/Keratometer, Fundus Camera, Slit Lamp, Digital Solutions to Ophthalmic Equipment
Year of Establishment 2013-03-01
Management System Certification ISO 9001, ISO 9000, ISO 13485
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Import & Export Mode Have Own Export License
OEM/ODM Availability Yes

Hydrocarbon Polymer Copper Comparison

	High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300) Contact Now	Quick View OEM Consumer Board 6layers OSP Surface Finish 0.25 Minimum Hole 3.5mil Line Width and Space Multilayer PCB Bonding Contact Now	Quick View Local Power 120 Micro Inches Shenjin Power Surface Finish High Frequency 3 Step HDI Multilayer PCB Coil for Industrial Device Contact Now	Quick View High Quality Printed Circuit Board Immersion Gold PCB Professional Multilayer PCB Mother Board Contact Now	Quick View China Circuit Board Layout Design Double Sided Layer Manufacture Isola Arlon Nelco Immersion Silver Rogers PCB Manufacturers Contact Now

Transaction Info
	High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300) Contact Now	Quick View OEM Consumer Board 6layers OSP Surface Finish 0.25 Minimum Hole 3.5mil Line Width and Space Multilayer PCB Bonding Contact Now	Quick View Local Power 120 Micro Inches Shenjin Power Surface Finish High Frequency 3 Step HDI Multilayer PCB Coil for Industrial Device Contact Now	Quick View High Quality Printed Circuit Board Immersion Gold PCB Professional Multilayer PCB Mother Board Contact Now	Quick View China Circuit Board Layout Design Double Sided Layer Manufacture Isola Arlon Nelco Immersion Silver Rogers PCB Manufacturers Contact Now
Price	Negotiable	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 1.00-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 pcs	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	T/T, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT
Quality Control
Product Certification	-	-	-	RoHS, UL CE, GS, ISO	-
Management System Certification	ISO 9001, ISO 9000, ISO 13485	-	-	ISO 9001, ISO 14001, IATF16949	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Polymer Ceramic Copper; Dielectric: Polymer Ceramic Copper; Material: Copper; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Wl; Pimd: Less Than -158dbc; Sample: Available; Dielectric Thickness: 1.034mm; Density(G/ Cm3): 1.57; Dielectric Constant: 3.0±0.05; Type of Copper Foil: RTF Copper Foil;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Keyword: Custom PCB; MOQ: 1 PCS; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Min. Line Width: 0.075mm(3mil); Copper Thickness: 0.5-12oz(18-420um); Min. Line Spacing: 0.075mm(3mil); Board Thickness: 0.2-6.0mm; Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free; One-Stop Service: PCB Assembly, Component Supply; Testing Service: 100% E-Testing;	Type: Rigid Circuit Board; Dielectric: Rogers Material; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: RO5880; Insulation Materials: Epoxy Resin; Brand: Kxpcba; Shape: Rectangular, Round, Slots, Cutouts, Complex; Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil; PCB Testing: E-Test, Fly Probe Test, Visual Checking; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Copper Thickness: 0.5-12oz(18-420um); Board Thickness: 0.2-6.0mm; Min. Line Width: 0.075mm(3mil); Min. Line Spacing: 0.075mm(3mil); Min Width of Annular Ring: 0.15mm(6mil); Service: 724 Hours Online;*
Supplier Name	New Vision Meditec Co., Limited	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen Jinxiong Electronic Co., Ltd
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