Buried Via PCB   Built on 32 Layer with Single End Impedance and Immersion Gold

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Enig
  • Base Material Copper Clad Laminate
  • Insulation Materials Epoxy Resin
  • Brand Bicheng
  • Transport Package Vacuum
  • Specification 90 X 90mm
  • Trademark Bicheng
  • Origin China

Product Description

General profile The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone, PDA board etc. Advantages A) Reduce the probability of ...

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Prototype Comparison
Transaction Info
Price US $ 9.99/ Piece US $ 1/ Piece US $ 1/ Piece US $ 1/ Piece US $ 0.10-2.00/ Piece
Min Order 1 Pieces 1000 Pieces 1000 Pieces 1000 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS RoHS RoHS -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, ISO 20000 ISO 9001, ISO 14001, ISO 20000 ISO 9001, ISO 14001, ISO 20000 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$10 Million - US$50 Million
Business Model OEM, Own Brand(Bicheng) OEM, ODM OEM, ODM OEM, ODM OEM, ODM, Own Brand(KMC)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: 6-12 months
Peak Season Lead Time: 6-12 months
Off Season Lead Time: 6-12 months
Peak Season Lead Time: 6-12 months
Off Season Lead Time: 6-12 months
Peak Season Lead Time: 6-12 months
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier