Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1 Oz;
Final Height of PCB: 1.6mm;
Surface Finish: Hot Air Soldering Leveling(HASL);
Impedance Control: Single Trace, 8.1mil 50 Ohm;
Solder Mask Color: Gloss Green;
Legend Color: White;
Minimum Trace and Space: 8.1 Mil/15 Mil;
Minimum / Maximum Holes: 0.52/6.0mm;
Via: Plated Through Hole(Pth);
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Shengyi, Kb, Nanya, Ilm;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black, Blue, Yellow;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Shengyi, Kb, Nanya, Ilm;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black, Blue, Yellow;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kmc;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kmc;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
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