4 Layer High Frequency PCB Built on RO4350b with Blind Via and Immersion Gold

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.45 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric RO4350b
  • Material Hydrocarbon/Woven Glass
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Glass Reinforced Hydrocarbon
  • Transport Package Vacuum
  • Specification 98.02 x 101.02 mm =1up
  • Trademark Bicheng Enterprise Limited
  • Origin China
  • Final Foil External 1.5 Oz
  • Final Foil Internal 0.5 Oz
  • Board Thickness 1.0 mm ±10%
  • Surface Finish Immersion Gold
  • Solder Mask Color Green
  • Colour of Component Legend White
  • Minimum Trace and Spac 5 Mil / 4.9 Mil
  • Minimum / Maximum Holes 0.3 mm / 5.5 mm
  • Via Minimum Size 0.3mm. Blind Via L1-L2, L1-L3
  • Test 100% Electrical Test Prior Shipment

Product Description

Brief Introduction Just as its name implies, high frequency is that the frequency is relatively high, generally refers to the frequency of >=300 MHz (i.e. wave length =1GHz is called microwave. Typical frequencies for wireless applications: * Current mobile: 0.9GHz - 2GHz * 3G systems: 2.5GHz ...

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High Frequency PCB Comparison
Transaction Info
Price US $ 0.45/ Piece US $ 0.60-1.60/ PCS US $ 0.06-0.23/ PCS US $ 1.30-1.50/ PCS US $ 1.00-1.30/ PCS
Min Order 1 Pieces 1 PCS 1 PCS 1 PCS 1 PCS
Payment Terms T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, Own Brand(Bicheng) OEM OEM OEM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1.5 Oz;
Final Foil Internal: 0.5 Oz;
Board Thickness: 1.0 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 5 Mil / 4.9 Mil;
Minimum / Maximum Holes: 0.3 mm / 5.5 mm;
Via: Minimum Size 0.3mm. Blind Via L1-L2, L1-L3;
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: OSP, Lead Free Hal;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Ipc Standards: Ipc-Class 2;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: OSP, Lead Free Hal;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Ipc Standards: Ipc-Class 2;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: OSP, Lead Free Hal;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Ipc Standards: Ipc-Class 2;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: OSP, Lead Free Hal;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Ipc Standards: Ipc-Class 2;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier