Specification |
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Polyimide;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Jointek;
Copper Weight: 18/25um, 18/35um, 35/35um, 18/50um, 18/70um, 70/70;
Surface Treatment: OSP;
Substrate: Pi or Pet;
Delivery Spec: 100m, 200m, 300m Per Roll;
Soldermask Color: White, Black, Red, Yellow, Gold etc;
Thickness: 0.1~0.3mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: Lf-Hal;
Solder Mask Type: Red;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Min. Line Spacing: 0.15mm;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: Enig;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Test: Flying Probe and Fixture;
Package: Vacuum Package;
Certificates: UL, RoHS, SGS, ISO9001;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Xjy;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Surface Finishing: HASL, Immersion Gold;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.1mm;
Min. Line Spacing: 0.1mm;
PCB Silkscreen: White;
PCB Solder Mask: Green;
Pack: Vacuum Packing;
|