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PCB Design Assemble High Quality Double-Sided Fr4 PCB Circuit Board OEM Assembly Service PCBA Design Manufacturer pictures & photos

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What is PCB Design Assemble High Quality Double-Sided Fr4 PCB Circuit Board OEM Assembly Service PCBA Design Manufacturer

Name: PCB Design Assemble High Quality Double-Sided Fr4 PCB Circuit Board OEM Assembly Service PCBA Design Manufacturer
Uploaded: 2023-09-06T16:59:50+08:00
Description: PCB Item Manufacture Capacity Layer Counts 1L-40L Min Hole Size(mechanical) 0.15mm Base Material NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic Min Hole Size(laser hole) 0.

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.15-9.98 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Chenlu
Transport Package Vacuum Packing
Specification 150*120mm
Trademark CHENLU CIRCUITS
Origin China

Product Description

PCB Item Manufacture Capacity Layer Counts 1L-40L Min Hole Size(mechanical) 0.15mm Base Material NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic Min Hole Size(laser hole) 0.1mm FPC Material Dupont,Taiflex,SYL,Thinflex Hole Size Tol (+/-) PTH:+0.075mm; ...

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Dongguan Chenlu Electronics Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Instruments & Meters
Main Products PCB Board, PCBA, PCB Assembly, MP3, Printed Circuit, Printed Wiring, Printed Circuit Board, Printed Board Assembly, Double-Sided Printed Board
Registered Capital 1000000 RMB
Plant Area 1001~2000 square meters

PCB Comparison

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Transaction Info
	Quick View PCB Design Assemble High Quality Double-Sided Fr4 PCB Circuit Board OEM Assembly Service PCBA Design Manufacturer Contact Now	Quick View Electronic Multilayer PCBA Assembly Factory in Shenzhen Contact Now	Shenzhen Source Manufacturer PCB and PCBA Manufacturer PCB PCBA Assembly Contact Now	One Stop Service Electronic Design High Quality Fr4 Black Core PCB Manufacturing PCBA Board Assembly Contact Now	Quick View High Quality OEM Gerber Files PCB PCBA Circuit Board Assembly Bom List Contact Now
Price	US $ 0.15-9.98/ Piece	US $ 2.68-5.60/ Piece	US $ 0.20-0.39/ Piece	US $ 0.20-3.90/ Piece	US $ 0.50-1.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	-	-	-
Management System Certification	-	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949
Trade Capacity
Export Markets	-	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Chenlu;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name	Dongguan Chenlu Electronics Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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