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US$0.15-9.98 / Piece
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What is High-Temperature PCB for Extreme Environment Applications

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.15-9.98 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Chenlu
  • Transport Package Vacuum Packing
  • Specification 150*120mm
  • Trademark CHENLU CIRCUITS
  • Origin China
  • Min Annular Ring 0.05mm/0.05mm
  • Layer Counts 1L-40L
  • HASL/Lf Hal 2.5um
  • Copper Weight 0.5--6 Oz

Product Description

PCB Item Manufacture Capacity Layer Counts 1L-40L Min Hole Size(mechanical) 0.15mm Base Material NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic Min Hole Size(laser hole) 0.1mm FPC Material Dupont,Taiflex,SYL,Thinflex Hole Size Tol (+/-) PTH:+0.075mm; ...

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PCB Comparison
Transaction Info
Price US $ 0.15-9.98/ Piece US $ 1/ Piece US $ 1/ Piece US $ 3.50-4.50/ Piece US $ 0.08-0.10/ PCS
Min Order 1 Pieces 1000 Pieces 1000 Pieces 1 Pieces 1 PCS
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union
Quality Control
Product Certification - RoHS RoHS - ISO,UL,RoHS
Management System Certification - ISO 9001, ISO 20000 ISO 9001, ISO 20000 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets - South America, Europe, Africa South America, Europe, Africa North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, Own Brand OEM
Average Lead Time - Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: 2 Layer;
Copper Thickness: 1oz;
Condition: Original Made;
Supplier Name

Dongguan Chenlu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier