Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Chenlu;
Min Annular Ring: 0.05mm/0.05mm;
Layer Counts: 1L-40L;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6 Oz;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 6;
Material Finished Thickness: 1.6mm;
Base: Fr4;
Special: High Frequency PCB;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
Lead Time: 8 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
Fast Turn: 3 Working Days;
|
Type: Rigid Circuit Board;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.0mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/5mil;
Special: High Tg Board, Strick Appearance Inspection;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 6;
Board Thickness: 1.6mm;
Soldermask Color: Green;
Surface Finish: Enig/3u'';
Specialities: BGA;
Base Material Type: Fr4;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
|
Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.25mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special: Smart Consumer Moudle, Half Hole of Gold Fing;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
|