High Quality Android Mobile Phone PCB Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9,999 pcs US$1.00

10,000+ pcs US$12.00

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Android Mobile Phone PCB Board
  • Transport Package Vacuum Packing/Blister/Plastic /Cartoon
  • Specification CE, RohS, UL, SGS, ISO9001, 94v0
  • Trademark OEM/ODM
  • Origin Shenzhen, Guangdong
  • Layer 1-22
  • Surface Finishing HASL, Enig, OSP, Immersion Au, AG, Sn
  • Min.Hole Size 0.1mm
  • Min.Line Spacing 3 Mil
  • PCBA QC X-ray, Aoi Test, Function Test(100% Test)
  • Specialised LED, Medical, Industrial, Control Board
  • Delivery PCB, 7-10 Days;PCBA, 2-3weeks

Product Description

WHY CHOOSE STHL PCBA Specification SMT Workshop : Quality System: 1. ISO-9001:2015 Quality System Standard 2. Quality Standard: IPC-610-D class 2, 3. Soldering Standard: J-STD-001 class 1,2,3 4. ESD Standard: ESD-MIL-STD-1686 5. Workshop management:5S 6. FAI-first article ...

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Mobile Phone PCB Board Comparison
Transaction Info
Price US $ 1.00-12.00/ pcs US $ 1/ Piece US $ 1/ Piece US $ 1/ Piece Negotiable
Min Order 1 pcs 1000 Pieces 1000 Pieces 1000 Pieces 1000 Pieces
Trade Terms FOB, CFR, CIF, EXW - - - -
Payment Terms Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification - RoHS RoHS RoHS RoHS
Management System Certification ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 20000 ISO 9001, ISO 20000 ISO 9001, ISO 20000 ISO 9001, ISO 20000
Trade Capacity
Export Markets North America, Europe, East Asia(Japan/ South Korea) South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Android Mobile Phone PCB Board;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Supplier Name

Shenzhen STHL Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier