Specification |
Conductive Type: Standard;
Integration: Standard;
Technics: Standard;
shape: Standard;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Operating Temperature: -55~ 150(Celsius);
Technics: Semiconductor IC;
Maximum Allowable Collector Current: 10A;
Maximum Collector Current (Icm): 500mA;
Maximum Power: 300MW;
Transistor Polarity: NPN Transistor;
Collector Breakdown Voltage (Vceo): 25V;
Ultrasonic Electronic Circuit Machine EQ: Ultrasonic Electronic Circuit Machine Equipment;
Supplier Type: Original Manufacturer;
DC Current Gain (Hfe) (Min) @ IC, Vce: DC Current Gain (Hfe) (Min) @ IC, Vce;
Mounting Type: Through Hole;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Operating Temperature: -55~ 150(Celsius);
Shape: DIP;
Technics: Semiconductor IC;
Maximum Allowable Collector Current: 10A;
Maximum Collector Current (Icm): 500mA;
Maximum Power: 300MW;
Transistor Polarity: NPN Transistor;
Collector Breakdown Voltage (Vceo): 25V;
Ultrasonic Electronic Circuit Machine EQ: Ultrasonic Electronic Circuit Machine Equipment;
Supplier Type: Original Manufacturer;
DC Current Gain (Hfe) (Min) @ IC, Vce: DC Current Gain (Hfe) (Min) @ IC, Vce;
Mounting Type: Through Hole;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
shape: DIP;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
shape: DIP;
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