Label Mounter

US$45,000.00-58,000.00 / Piece

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What is High Quality SMT Label Mounter for Printing Logo on PCBA

Name: High Quality SMT Label Mounter for Printing Logo on PCBA
Uploaded: 2023-10-24T13:46:44+08:00
Description: High Quality SMT Label Mounter for Printing Logo on PCBA ------------Introduction--------------------------------------------- * I.C.T has 20 years SMT experience. * Overseas engineer can go to your

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$45,000.00-58,000.00 / Piece

Sepcifications

Condition New
Speed High Speed
Precision High Precision
Certification CE
Warranty 12 Months
Automatic Grade Automatic
Transport Package Vacuum Plywood Case
Specification L1000 *W1200 *H1500 mm
Trademark I. C. T
Origin China
Label Size 3*3 ~ 30*10mm
Labeling Precision ±0.05mm
Labeling Angle 360°
Labeling Heigh 0.6-7.0mm
Nozzle Vacuum Mode Vacuum Pump
PCB Size L50*W80mm ~L450 * W350mm
PCB Thickness 0.5mm-6mm
Position System 5m CCD
Operation Mode X,Y,Z,R Movement(Servo Motor)
Conveyor Speed 0 ~ 1000mm/Min
Power AC220V/50Hz, Total Power: 1kVA
Air Pressure 0.5~0.6MPa
Weight 1250kg

Product Description

High Quality SMT Label Mounter for Printing Logo on PCBA ------------Introduction--------------------------------------------- * I.C.T has 20 years SMT experience. * Overseas engineer can go to your factory to installation and training for free. * I.C.T will provide SMT technical consultation at ...

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Dongguan ICT Technology Co.,Ltd.

Diamond Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Manufacturing & Processing Machinery
Main Products SMT, Reflow Oven, Reflow Soldering Machine, Lead Free Reflow Oven, Chip Mounter, Pick&Place Machine, Chip Shooter Machine, Juki Chip Mounter, SMT Machine, SMT Equipment
Management System Certification ISO 9001, ISO 14000, LEED, ISO 17025

Label Mounter Comparison

	Quick View High Quality SMT Label Mounter for Printing Logo on PCBA Contact Now	Quick View Die Bonding, Process for Placing a Chip on a Package Substrate Contact Now	Quick View High End Die Bonder Equipment to Assist in Semiconductor Packaging Contact Now	Quick View High Precision Flip Chip Die Bonder dB100 Termway Contact Now	Quick View dB100s Submicron Pick and Place Machine Die Bonder with Flip Chip Contact Now

Transaction Info
	Quick View High Quality SMT Label Mounter for Printing Logo on PCBA Contact Now	Quick View Die Bonding, Process for Placing a Chip on a Package Substrate Contact Now	Quick View High End Die Bonder Equipment to Assist in Semiconductor Packaging Contact Now	Quick View High Precision Flip Chip Die Bonder dB100 Termway Contact Now	Quick View dB100s Submicron Pick and Place Machine Die Bonder with Flip Chip Contact Now
Price	US $ 45,000.00-58,000.00/ Piece	US $ 250,000.00-450,000.00/ Piece	US $ 250,000.00-450,000.00/ Piece	US $ 74,800.00-114,500.00/ Piece	US $ 74,800.00-114,500.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T	T/T	T/T, Western Union	T/T, Western Union
Quality Control
Product Certification	CE	-	ISO, CE	ISO, CE	ISO, CE
Management System Certification	ISO 9001, ISO 14000, LEED, ISO 17025	ISO 9001	ISO 9001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	-	-	-	-
Product Attributes
Specification	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Label Size: 33 ~ 3010mm; Labeling Precision: ±0.05mm; Labeling Angle: 360°; Labeling Heigh: 0.6-7.0mm; Nozzle Vacuum Mode: Vacuum Pump; PCB Size: L50W80mm ~L450 * W350mm;* PCB Thickness: 0.5mm-6mm; Position System: 5m CCD; Operation Mode: X,Y,Z,R Movement(Servo Motor); Conveyor Speed: 0 ~ 1000mm/Min; Power: AC220V/50Hz, Total Power: 1kVA; Air Pressure: 0.5~0.6MPa; Weight: 1250kg;	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;	After-sales Service: Online and at Site Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: Medium-speed Chip Mounter; Max. Chip Size: 20mm 20mm (5050mm Optional); Min. Chip Size: 0.2mm 0.2mm;* Mounting Precision: ±3um 3δ; Feeding Mode: 2 Inch Waffle Box2;* Substrate Size: 150150mm;* X Y Z Axis Motion System: Roller Screw + Servo Motor; X Y Axis Resolution: 0.1um; Power Supply: 220V, 50Hz; Net Weight: 300kg;	After-sales Service: Online and at Site Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: Medium-speed Chip Mounter; Max. Chip Size: 20mm 20mm (5050mm Optional); Min. Chip Size: 0.2mm 0.2mm;* Mounting Precision: ±3um 3δ; Feeding Mode: 2 Inch Waffle Box2;* Substrate Size: 150150mm;* X Y Z Axis Motion System: Roller Screw + Servo Motor; X Y Axis Resolution: 0.1um; Power Supply: 220V, 50Hz; Net Weight: 300kg;
Supplier Name	Dongguan ICT Technology Co.,Ltd.	Suzhou Bozhon Semiconductor Co., Ltd	Suzhou Bozhon Semiconductor Co., Ltd	Termway (Beijing) Precision Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.
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