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What is High Density PCB Used in Music Instruments/Wireless/EV Charger Multilayer PCB

Name: High Density PCB Used in Music Instruments/Wireless/EV Charger Multilayer PCB
Uploaded: 2023-10-20T15:28:30+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand EEG
Transport Package Vacuum
Specification ENIG
Trademark EEG
Origin Made in China

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory
Business Range Electrical & Electronics
Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Type of Ownership Limited Company
Plant Area 501~1000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949

HDI PCB Comparison

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Transaction Info
	Quick View High Density PCB Used in Music Instruments/Wireless/EV Charger Multilayer PCB Contact Now	Quick View Industrial Main PCB Board for Printer/Scanner/Set Top Box Contact Now	Quick View Electronics PCB Manufacturer for Tablet PC/White Goods/LCD TV Contact Now	Quick View 4L PCB Min. Hole Wall Cu 30um with Lf-HASL for Industrial Frequency Converter Contact Now	Quick View 4layer PCB 1.0mm Enig, Min. Space 2.8mil, BGA to Line 2.5mil with Impedance Control Contact Now
Price	US $ 0.10-15.00/ Piece	US $ 1.15-22.00/ Piece	US $ 2.13-21.00/ Piece	US $ 2.25-26.00/ Piece	US $ 0.23-28.00/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Western Europe	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: EEG;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi Material; Insulation Materials: Epoxy Resin; Layer Count: 4-24layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc III; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg180; Insulation Materials: Epoxy Resin; Layer Count: 4-28layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc II; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Layer Count: 4-32layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc II; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 4-36layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc II; Certificates: RoHS CCC ISO;
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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