Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: PCB, Components Sourcing, Assembly, Test, Package;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1 PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger.OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 0.5 Oz;
Minimum Trace and Space: 7.8 Mil / 7.1 Mil;
Minimum / Maximum Holes: 0.4 mm /3.175 mm;
Via: Minimum Size 0.3mm;
Test: 100% Electrical Test;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 1 Oz;
Minimum Trace and Space: 4 Mil / 4 Mil;
Minimum / Maximum Holes: 0.3 mm /3.5 mm;
Via: Minimum Size 0.3mm. Blind Via;
Test: 100% Electrical Test;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Soldermask Color: Blue;
Silkscreen Color: White;
Final Foil Internal: 0.5 Oz;
Minimum Trace and Space: 4 Mil / 4 Mil;
Minimum / Maximum Holes: 0.3/4.22mm;
Via: Minimum Size 0.3mm;
Test: 100% Electrical Test;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: HASL Lead Free;
out Layer Copper: 1 Oz;
Soldermask Color: Green;
Silkscreen Color: White;
Minimum Trace and Space: 4 Mil / 4 Mil;
Minimum / Maximum Holes: 0.3/4.22mm;
Final Foil Internal: 1 Oz;
Via: Minimum Size 0.3mm;
Test: 100% Electronic Test;
|