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Bluetooth PCB Circuit Board with Competitive Price

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 piece US$0.93

100+ piece US$0.88

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-3
Material Phenolic Paper Laminate
Application Computer
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Fr4
Insulation Materials Organic Resin
Brand Fastline
Transport Package Vacuum Packing
Specification IP class -2
Trademark Fastline
Origin Shenzhen, China
Board Material Fr4
Layers 1 to 30 Layers
Board Thickness 1.6mm
Copper Thickness 1oz
Solder Mask Green
Silk Screen White
Surface Treatment HASL Lead Free
Test 100%
Lead Time 6-8 Working Days
Min. Line Width 0.075mm

Product Description

Bluetooth PCB Circuit Board with competitive Price Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

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Fastline Circuits Co., Limited

Gold Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, PCB Board, LED PCB, Circuit Board, PCB
Registered Capital 5000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Bluetooth PCB Board Comparison

	Bluetooth PCB Circuit Board with Competitive Price Contact Now	Cross-Border PCB Raw Materials Fr4 Fiberglass Based Cooper Clad Laminate Sheet Board Contact Now	Cross-Border High Frequency Ccl Material Printed Circuit Board Rigid PCB Contact Now	Cross-Border China Manufacturer A Grade Single Side 18um Copper 1.0mm Fr4 Ccl for PCB Contact Now	Cross-Border China Supplier Hot Product Fr4 Ccl Copper Clad Laminate for Single Side PCB Contact Now

Transaction Info
	Bluetooth PCB Circuit Board with Competitive Price Contact Now	Cross-Border PCB Raw Materials Fr4 Fiberglass Based Cooper Clad Laminate Sheet Board Contact Now	Cross-Border High Frequency Ccl Material Printed Circuit Board Rigid PCB Contact Now	Cross-Border China Manufacturer A Grade Single Side 18um Copper 1.0mm Fr4 Ccl for PCB Contact Now	Cross-Border China Supplier Hot Product Fr4 Ccl Copper Clad Laminate for Single Side PCB Contact Now
Price	US $ 0.88-0.93/ piece	Negotiable	Negotiable	Negotiable	Negotiable
Min Order	1 piece	50 Square Meters	50 Square Meters	50 Square Meters	50 Square Meters
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T	L/C, T/T	L/C, T/T	L/C, T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe
Annual Export Revenue	-	> US $100 Million	> US $100 Million	> US $100 Million	> US $100 Million
Business Model	OEM, ODM	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;
Supplier Name	Fastline Circuits Co., Limited	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.
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