PCB Board

US$0.88-0.93 / piece

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What is Multilayer Printed Circuit Board Factory Price

Name: Multilayer Printed Circuit Board Factory Price
Uploaded: 2025-04-21T10:01:58+08:00
Description: Multilayer printed circuit board Factory price Product Description Fastline PCB's aim Customer Satisfaction is Always Our First

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 piece US$0.93

100+ piece US$0.88

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-3
Material Phenolic Paper Laminate
Application Computer
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Fr4
Insulation Materials Organic Resin
Brand Fastline
Transport Package Vacuum Packing
Specification IP class -2
Trademark Fastline
Origin Shenzhen, China
Board Material Fr4
Layers 1 to 30 Layers
Board Thickness 1.6mm
Copper Thickness 1oz
Solder Mask Green
Silk Screen White
Surface Treatment HASL Lead Free
Test 100%
Lead Time 6-8 Working Days
Min. Line Width 0.075mm

Product Description

Multilayer printed circuit board Factory price Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Board Comparison

	Multilayer Printed Circuit Board Factory Price Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Immersion Gold Enig Imm-AG 10layer Circuit Board PCB Contact Now	Quick View Motherboard 10layer Enig PCB with Gold Fingers Tg170 Impedance Control for Telecommunication Contact Now

Transaction Info
	Multilayer Printed Circuit Board Factory Price Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Immersion Gold Enig Imm-AG 10layer Circuit Board PCB Contact Now	Quick View Motherboard 10layer Enig PCB with Gold Fingers Tg170 Impedance Control for Telecommunication Contact Now
Price	US $ 0.88-0.93/ piece	US $ 0.265-3.55/ Piece	US $ 0.223-3.15/ Piece	US $ 0.376-3.89/ Piece	US $ 0.758-4.96/ Piece
Min Order	1 piece	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Trace Line&Space: 3.9mil; Inner Core Material: 0.1mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Hole to Line: 7mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold+Gold Fingers; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;
Supplier Name	Fastline Circuits Co., Limited	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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