Fr4 PCB Factory Multilayer PCB in Printed Circuit Board Online

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$8.21

1,000-4,999 Pieces US$7.69

5,000+ Pieces US$6.99

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Board Layer 4 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Blue
  • Silksreen White
  • Surface Finihsing OSP
  • Lead Time 6-8 Working Days

Product Description

Products Introduction Parameters &Data Sheet PCB SIZE 32 x 45mm=1PCS BOARD TYPE Number of Layers Multilayer PCB, 4 Layer PCB Surface Mount Components YES Through Hole Components YES LAYER STACKUP copper ------- 17.5 um(0.5 oz)+plate TOP layer Prepreg 7628 0.195mm copper ...

Learn More

PCB Board Comparison
Transaction Info
Price US $ 6.99-8.21/ Piece US $ 0.9/ Piece US $ 0.9/ Piece US $ 0.83-8.99/ Piece US $ 2.00-2.80/ PCS
Min Order 1 Pieces 1 Pieces 1 Pieces 10 Pieces 1 PCS
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Paypal
Quality Control
Product Certification - - - ISO 13485, ISO 14001/9001, CE, RoHS and So on UL,ISO 9001,ISO14001,IATF16949
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, IATF16949, QC 080000 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - Above US$100 Million Above US$100 Million US$10 Million - US$50 Million Above US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: Other;
Mechanical Rigid: Other;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Other;
Board Thickness: 1.6mm;
PCB Max Panel Size: 1190*350mm/450*450mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: Other;
Mechanical Rigid: Other;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Other;
Board Thickness: 1.6mm;
PCB Max Panel Size: 1190*350mm/450*450mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customer Brand;
Layer: 6 Layers (1-64 Layer Optional);
Board Thickness: 0.1 to 6.0mm(4 to 240mil);
Copper Thickness: 0.25 Oz -12 Oz;
Minial Component: 03015;
Mnimum Placement Spacing of BGA: 0.3mm;
Min.Finished Hole Size (Laser Hole): 0.1mm;
Minimum Line Width/Space: 0.076/0.076mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Board Layer: 8 L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier