Mustar Custom PCBA Manufacturer

US$0.90 / Piece

Mustar PCBA Circuit Electronic Board Assembly Universal PCB Board PCBA Manufacturers pictures & photos

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What is Mustar PCBA Circuit Electronic Board Assembly Universal PCB Board PCBA Manufacturers

Name: Mustar PCBA Circuit Electronic Board Assembly Universal PCB Board PCBA Manufacturers
Uploaded: 2025-02-17T19:18:08+08:00
Description: Recommended by seller Product Paramenters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO

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Price

Min. Order Reference FOB Price

1 Piece US$0.90 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Medical Instruments
Flame Retardant Properties Other
Mechanical Rigid Other
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Other
Board Thickness 1.6mm
PCB Max Panel Size 1190*350mm/450*450mm

Product Description

Recommended by seller Product Paramenters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. Board Thickness 0.11-0.5mm Max.Copper Thickness 4OZ Layer ...

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Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCBA, PCB Assembly, PCB, Electronic Component, IC
Number of Employees 35
Year of Establishment 2021-12-16
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Mustar Custom PCBA Manufacturer Comparison

	Mustar PCBA Circuit Electronic Board Assembly Universal PCB Board PCBA Manufacturers Contact Now	Quick View Double Side PCB/Multilayer PCB/Manufacturer/Printed Circuits Board/Shenzhen Abis Contact Now	Quick View Multilayer PCB Fr4 Printed Circuits Boards HDI HASL RoHS Compliant UL Contact Now	Multilayer PCB Immersion Gold Printed Circuits Boards Gold Finger Contact Now	Quick View Shenzhen Multilayer Rigid PCB OEM Green Mass Production Printed Circuit Board Contact Now

Transaction Info
	Mustar PCBA Circuit Electronic Board Assembly Universal PCB Board PCBA Manufacturers Contact Now	Quick View Double Side PCB/Multilayer PCB/Manufacturer/Printed Circuits Board/Shenzhen Abis Contact Now	Quick View Multilayer PCB Fr4 Printed Circuits Boards HDI HASL RoHS Compliant UL Contact Now	Multilayer PCB Immersion Gold Printed Circuits Boards Gold Finger Contact Now	Quick View Shenzhen Multilayer Rigid PCB OEM Green Mass Production Printed Circuit Board Contact Now
Price	US $ 0.9/ Piece	US $ 0.01-150.00/ Piece	US $ 0.01-150.00/ Piece	US $ 0.01-150.00/ Piece	US $ 0.0001-99.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal	T/T	T/T	T/T	T/T, Western Union, Paypal
Quality Control
Product Certification	-	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	Above US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Medical Instruments; Flame Retardant Properties: Other; Mechanical Rigid: Other; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Other; Board Thickness: 1.6mm; PCB Max Panel Size: 1190350mm/450450mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Copper Thickness: 0.5-8oz; Eng Thickness: 1-3u; Board Thickness: 0.2-6mm; Hard Gold Thickness: 5-50u;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Copper Thickness: 0.5-8oz; Eng Thickness: 1-3u; Board Thickness: 0.2-6mm; Hard Gold Thickness: 5-50u;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Copper Thickness: 0.5-8oz; Eng Thickness: 1-3u; Board Thickness: 0.2-6mm; Hard Gold Thickness: 5-50u;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 4 Layers; Solder Mask: Green; Legend: Write; Surface Finish: Enig (2u''); Thickness: 1.6mm;
Supplier Name	Mu Star (shenzhen) Industry Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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