Printed Circuit Board
US$0.42-0.90 / Piece
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What is Fast Multilayer Blue Rigid Printed Circuit Board Prototype with Good Price

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000-99,999 Pieces US$0.71

100,000+ Pieces US$0.42

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Board Layer 3 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Blue
  • Silksreen White
  • Surface Finihsing HASL-Lf
  • Lead Time 6-8 Working Days
  • Text Fly Probe Texing
  • Min. Hole Size 0.20 mm
  • Min Line Width&Space 0.15 mm

Product Description

Fast Multilayer Blue Rigid Printed Circuit Board Prototype with Good Price Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pleas see our pcb catalog ...

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Printed Circuit Board Comparison
Transaction Info
Price US $ 0.42-0.90/ Piece US $ 0.10-20.00/ Piece US $ 1.00-12.80/ Piece US $ 1.00-30.00/ Piece US $ 1.00-12.60/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 3 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Text: Fly Probe Texing;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Complex;
Application: Industrial PCBA;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Gt;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Applications: PCBA Board;
Structure: Multilayer Rigid PCB;
Dielectric: FR-2;
Material: Complex;
Application: Industrial PCBA;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Gt;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Applications: Circuit Board Assembly;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Complex;
Application: Industrial PCBA;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Gt;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier