Gold Finger Fr4 BGA PCB&PCBA Printed Circuit Board Assembly Components

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$3.63-4.77 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Ca
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Board Layer 2 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Blue
  • Silksreen White
  • Min Pad +/- 0.1mm (4mil)
  • Surface Finihsing HASL-Lf
  • Lead Time 6-8 Working Days
  • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
  • Packing Type Carton + Vacuum
  • Test Fly Probe Testing
  • Min Board Thickness 0.1mm Only for Single and Double Sided
  • Min. Line Width/Space 0.05mm (2mil)
  • Outline Machining Accuracy +/- 0.1mm (4mil)
  • MOQ 1 PCS

Product Description

Gold Finger FR4 BGA PCB&PCBA Printed Circuit Board Assembly Components Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog ...

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Immersion Gold PCB Comparison
Transaction Info
Price US $ 3.63-4.77/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Surface Finishing: Enig 2u'';
Raw Material: Fr-4.High Tg Fr-4.PTFE.Aluminum Base;
Board Thickness: 0.20mm--8.00mm;
Layer: 1 Layer-20 Layer;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Surface Finishing: Peelable Mask;
out Layer Copper Thickness: 18um--350um;
Inner Layer Copper Thickness: 17um--175um;
Outline Tolerance: +/-0.13mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: Enepig;
Solder Mask Type: Lpi;
Surface Finished: HASL, Enig, Chem. Tin, Flash Gold, OSP, Gold Finge;
Board Thickness: 0.20mm--8.00mm;
Structure: Metal Base Rigid PCB;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Board Thickness: 1.0;
Mask: White Solder Mask;
Npth Hole Tolerance: +/- 0.075mm;
Pth Hole Tolerance: +/-0.05mm;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier