2300f 20V Sot-23 Packaging Mosfet for LED Application

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

100 Pieces Negotiable

Sepcifications

  • Trademark Goford
  • Origin China
  • Manufacturing Technology Discrete Device
  • Type N-type Semiconductor
  • Brand V

Product Description

Product Description 2300F 20V 6A SOT-23 Mosfet (electronic components distributor) Part Number 2300F VDSS 20V ID 6A RDS 20-27 mΩ @ vgs=4.5V Vth 0.65V Package SOT-23 Ciss 630 pF Crss 60 pF Datasheet You may like For more products details, please contact us ! ...

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ISO9001 Comparison
Transaction Info
Price Negotiable US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: 1 Month(s) Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Manufacturing Technology: Discrete Device;
Type: N-type Semiconductor;
Brand: V;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Structure: Multilayer Rigid PCB;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Brand: Ti;
Supplier Name

Wuxi Goford Semiconductor Co., Ltd.

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier