| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 12.7mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Digital Applications;
Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 20.7mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Digital Applications;
Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 32.7mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Antennas;
Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
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