Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Not Specified;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Surface Finishing: Immersion Gold, Immersion Silver, OSP, Hal, Hal Lf;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Unice;
Layer: 1 to 20;
Mini Board Size: 8*8mm;
Max Board Size: 650*610mm;
Board Thickness: 0.3mm~3.5mm;
Finished Inner Copper Thickness: H/H0z-4/40z;
Finished Outer Copper Thickness: H/H0z-5/50z;
Min Hole Size: 0.2mm;
Surface Finishing: OSP,Immersion Gold,Gold Plating,Enig,Enepig;
Warranty: 1 Year;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Unice;
Layer: 1 to 20;
Mini Board Size: 8*8mm;
Max Board Size: 650*610mm;
Board Thickness: 0.3mm~3.5mm;
Finished Inner Copper Thickness: H/H0z-4/40z;
Finished Outer Copper Thickness: H/H0z-5/50z;
Min Hole Size: 0.2mm;
Surface Finishing: OSP,Immersion Gold,Gold Plating,Enig,Enepig;
Warranty: 1 Year;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Ucreate PCB;
Copper Thickness: 2oz;
Surface Finishing: Immersion Gold PCB;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Test: Flying Probe and Fixture;
Certificates: UL, ISO, RoHS, Ts;
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