Specification |
Application: Ceramic Decorations, Refractory, Structure Ceramic, Industrial Ceramic, Heat Conduction, Coating, Catalysts;
Type: Powder;
Material: Aluminum Nitride;
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Application: Refractory, Structure Ceramic, Industrial Ceramic;
Type: Ceramic Plates;
Name: Aluminum Nitride (Ain) Ceramic Heater;
Density: 3.3G/Cm3;
Thermal Conductivity: >180W/M*K;
Purity: 99.7% Aluminum Nitride Aln;
Technology: Hot Pressing Aln Aluminum Nitride;
Keyword: HP Aln Aluminum Nitride;
Flexural Strength: 350MPa;
Elastic Modulus: 320gpa;
Harness: 890hl;
Thermal Expansion Coefficient: 4.4;
Dielectric Constant: 9;
Usage: Thermal Conductivity;
Max. Size: Od380*H50mm;
Export Experience: Aluminum Nitride (Ain) Ceramic Heater;
Advantage: Semiconductor Aluminum Nitride Ceramic Parts;
Material: Aln Aluminum Nitride;
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Application: Aerospace, Electronics, Medical, Refractory, Industrial Ceramic;
Type: Ceramic Parts;
Usage: Wear Resistance;
Color: Black;
Compressive Strength: ≥2200;
Thermal Conductivity: 100-120W/M.K;
Hardness: ≥100;
Processing Service: Moulding;
Density: 2.65-3.1g/cm3;
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Application: Refractory, Structure Ceramic, Industrial Ceramic;
Type: Ceramic Plates;
Name: Aluminum Nitride Ceramic Aln Material;
Density: 3.3G/Cm3;
Thermal Conductivity: >180W/M*K;
Purity: 99.7% Aluminum Nitride Aln;
Technology: Hot Pressing Aln Aluminum Nitride;
Keyword: HP Aln Aluminum Nitride;
Flexural Strength: 350MPa;
Elastic Modulus: 320gpa;
Harness: 890hl;
Thermal Expansion Coefficient: 4.4;
Dielectric Constant: 9;
Usage: Thermal Conductivity;
Max. Size: Od380*H50mm;
Export Experience: Semiconductor Aln Ceramic Parts;
Advantage: Semiconductor Aluminum Nitride Ceramic Parts;
Material: Aln Aluminum Nitride;
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Application: Refractory, Structure Ceramic, Industrial Ceramic;
Type: Ceramic Plates;
Name: E-Chucks Aluminum Nitride;
Density: 3.3G/Cm3;
Thermal Conductivity: >180W/M*K;
Purity: 99.7% Aluminum Nitride Aln;
Technology: Hot Pressing Aln Aluminum Nitride;
Keyword: HP Aln Aluminum Nitride;
Flexural Strength: 350MPa;
Elastic Modulus: 320gpa;
Harness: 890hl;
Thermal Expansion Coefficient: 4.4;
Dielectric Constant: 9;
Usage: Thermal Conductivity;
Max. Size: Od380*H50mm;
Export Experience: Semiconductor Aln Ceramic Parts;
Advantage: Semiconductor Aluminum Nitride Ceramic Parts;
Material: Aln Aluminum Nitride;
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