Sj301 Welding Flux for Saw Wire EL8/Em12K pictures & photos

Sj301 Welding Flux for Saw Wire EL8/Em12K

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About this Item

Price

Min. Order Reference FOB Price

1 Ton Negotiable

Sepcifications

state Solid
pH Alkaline
Type Inorganic
Melting Point >600℃
Chemical Composition Sio2+TiO2=25-35
Function Protect Weld Metal
Application Submerged-arc Welding
Manufacturing Method Smelting
Transport Package Kraft Bag with Plastic Lining Inside
Specification 25kg/bag, 40bags/wooden pallet
Trademark Panding
Origin Laiwu City, Shandong Province, China
Grain Size 10-60mesh
Packaging Details 25kg Welding Flux /Kraft Paper Bag, 40 Bags/Pallet

Product Description

SJ301 Welding Flux For SAW WIRE EL8/EM12K SJ301 TECHNICAL DATA 1)Specifications: AWS-A5.17 F6A0-EL8 F7A2-EM12K EN760 SA CS 1 89 AC H5 2)Description: SJ301 is an agglomerated calcium-silicate type welding flux. Basicity: 1.0 (B//W) It is gray and round grain, mesh: 10-40. Regularly shaped ...

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Shandong Hulin Welding Material Co., Ltd.

Gold Member Since 2015

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products Submerged Arc Welding Flux, Welding Flux, Welding Powder, Agglomerated Flux, Saw Flux, Saw Wire, MIG Wire, Welding Wire, Welding Consumables, Welding Materials
Management System Certification ISO 9001

Welding Flux Comparison

	Sj301 Welding Flux for Saw Wire EL8/Em12K Contact Now	Quick View Sn62.8pb36.8AG0.4 Tin Lead Silver Soldering Paste Middle Temperature Solder Paste for PCB SMD SMT BGA Reballing Contact Now	Quick View SMT SMD PCB BGA Tin Soldering Liquid Welding Solder Paste Contact Now	Quick View Eutectic Solder Paste 183degree Celsius for Jetting Printing Soldering Contact Now	Quick View RoHS Compliant Rosin Reflow Soldering Pb Free Solder Paste for SMD Components Contact Now

Transaction Info
	Sj301 Welding Flux for Saw Wire EL8/Em12K Contact Now	Quick View Sn62.8pb36.8AG0.4 Tin Lead Silver Soldering Paste Middle Temperature Solder Paste for PCB SMD SMT BGA Reballing Contact Now	Quick View SMT SMD PCB BGA Tin Soldering Liquid Welding Solder Paste Contact Now	Quick View Eutectic Solder Paste 183degree Celsius for Jetting Printing Soldering Contact Now	Quick View RoHS Compliant Rosin Reflow Soldering Pb Free Solder Paste for SMD Components Contact Now
Price	Negotiable	US $ 30/ kg	US $ 40/ kg	US $ 30/ kg	US $ 40/ kg
Min Order	1 Tons	50 kg	50 kg	50 kg	50 kg
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	-	RoHS	-	RoHS
Management System Certification	ISO 9001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: 1 Month(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	state: Solid; pH: Alkaline; Type: Inorganic; Melting Point: >600℃; Chemical Composition: Sio2+TiO2=25-35; Function: Protect Weld Metal; Application: Submerged-arc Welding; Manufacturing Method: Smelting; Grain Size: 10-60mesh; Packaging Details: 25kg Welding Flux /Kraft Paper Bag, 40 Bags/Pallet;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Pb; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD SMT Component Reflow Soldering; Application 3: for BGA Reballing;	state: Solid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD SMT Component Reflow Soldering; Application 3: for Electronics Welding;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Pb; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for Jetting Soldering; Application 3: for SMT PCB Reflow Soldering;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD Soldering; Application 3: for PCB Reflow Soldering;
Supplier Name	Shandong Hulin Welding Material Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.
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