PCB Assemblies Contract Manufacturing for Full Turnkey Services Video

Name: PCB Assemblies Contract Manufacturing for Full Turnkey Services
Uploaded: 2022-09-15T09:43:33+08:00
Description: PCB Assemblies Contract Manufacturing for Full Turnkey Services Specification: PCB capability and services: 1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive pri

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About this Item

Price

Min. Order Reference FOB Price

10 Pieces US$0.15-12.00 / Piece

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Fexible
Processing Technology Customized
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

PCB Assemblies Contract Manufacturing for Full Turnkey Services Specification: PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Registered Capital 147802.18 USD
Plant Area 3200 square meters
Management System Certification ISO9001:2015
OEM/ODM Availability Yes

PCB Assembly Services Comparison

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Transaction Info
	Quick View PCB Assemblies Contract Manufacturing for Full Turnkey Services Contact Now	Quick View 4 Layer PCB Carbon Oil Keyboard Board Contact Now	Quick View High Precision Custom Multilayer Enig Printed Circuit Board Immersion Gold PCB Contact Now	Multilayer Printed Circuit Board Medical Electronics Enig Rigid-Flex PCB with High-Quality Contact Now	Quick View EV Charger PCB Board Emergency Light Electric Heater Kids Car Heaterelectronic Music Toy Circuit Board Contact Now
Price	US $ 0.15-12.00/ Piece	US $ 3.80-4.00/ Piece	US $ 2.50-5.50/ Piece	US $ 2.50-5.50/ Piece	US $ 2.00-5.00/ Piece
Min Order	10 Pieces	10 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Paypal, Money Gram	T/T	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO 9001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	-
Trade Capacity
Export Markets	Domestic	-	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, Own Brand	OEM, Own Brand	-
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Not Specified; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Not Specified; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Finest Pcb Assembly Limited
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