Multilayer Printed Circuit Board Medical Electronics Enig Rigid-Flex PCB with High-Quality

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$2.50-5.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology HASL Lead-Free
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Not Specified
  • Transport Package by Vacuum Packing in Cartons
  • Trademark KMC
  • Origin Shengzhen Guangdong
  • Material Type Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger
  • Layer Counts 1--30
  • Board Thickness 0.2mm--6.0mm
  • Fished Outer Copper 1oz--5oz
  • Minimum Trace Width 3mil/4mil
  • Surface Treatment Type HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;

Product Description

Product De Basic Info Type: Rigid Circuit Board Dielectric: FR-4 Flame Retardant Properties: V0 Mechanical Rigid: Rigid Insulation Materials: Epoxy Resin Brand: Kb ,Shengyi,Ilm Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 ...

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PCB Comparison
Transaction Info
Price US $ 2.50-5.50/ Piece US $ 0.10-20.00/ Piece US $ 0.10-20.00/ Piece US $ 1.00-10.00/ pcs US $ 0.10-20.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 5 pcs 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - UL,ISO9001&ISO14001,SGS,RoHS Report - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, Own Brand OEM OEM OEM, ODM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3mil/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: OEM/ODM;
Item: PCB Board Air Conditioner Part PCB PCB Manufacture;
Regesiter Torlerance: 0.05mm;
PCB with Green Solder Mask and Lf-Free S: 0.027"(0.675mm);
Board Thickness: 0.0075"(0.2mm)-0.125"(3.2mm);
Board Thickness Tolerance: 10%;
Copper Thickness: 0.5oz - 4oz;
Impedance Control: 10%;
Min Trace Width: 0.005"(0.125mm);
Min Annular Ring: 0.005"(0.125mm);
SMD Pitch: 0.012"(0.3mm);
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Supplier Name

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen STHL Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier