Customized Electronic SMT DIP Technology One Stop Box Build PCBA PCB Assembly Video

Name: Customized Electronic SMT DIP Technology One Stop Box Build PCBA PCB Assembly
Uploaded: 2025-02-28T16:14:19+08:00
Description: Customized Electronic SMT DIP Technology One Stop Box Build PCBA PCB Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description,

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.10

5,000+ Pieces US$0.65

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Fexible
Processing Technology Customized
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

Customized Electronic SMT DIP Technology One Stop Box Build PCBA PCB Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and PCBA ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Registered Capital 147802.18 USD
Plant Area 3200 square meters
Management System Certification ISO9001:2015
OEM/ODM Availability Yes

PCB Assembly Comparison

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Transaction Info
	Customized Electronic SMT DIP Technology One Stop Box Build PCBA PCB Assembly Contact Now	Quick View Multilayer HDI PCB Enig Printed Circuit Board with Blind Buried Vias Contact Now	Quick View Enig /Blind and Buried Vias Multilayer PCB in Shenzhen with Factory Price Contact Now	Quick View Custom Printed Circuit Board Solutions for Drone Technology Contact Now	Quick View Shenzhen Immersion Gold Multilayer PCB, HDI Printed Circuit Board with Blind and Buried Vias Contact Now
Price	US $ 0.65-5.00/ Piece	US $ 5.60-7.30/ Piece	US $ 5.60-7.30/ Piece	US $ 0.11-0.99/ Square Meter	US $ 5.60-7.30/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Square Meters	1 Pieces
Payment Terms	T/T, D/P, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO 9001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$10 Million - US$50 Million
Business Model	OEM, ODM	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand()	OEM, ODM, Own Brand(KMC)
Average Lead Time	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;; Certificates: UL, RoHS, SGS, ISO9001 ISO14000; PCB Testing: E-Testing; Flying Probe Testing; Shipping: DHL, UPS, TNT, FedEx, etc;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;; Certificates: UL, RoHS, SGS, ISO9001 ISO14000; PCB Testing: E-Testing; Flying Probe Testing; Shipping: DHL, UPS, TNT, FedEx, etc;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;; Certificates: UL, RoHS, SGS, ISO9001 ISO14000; PCB Testing: E-Testing; Flying Probe Testing; Shipping: DHL, UPS, TNT, FedEx, etc;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Keep Moving Circuits Co., Ltd.
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