| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Customers Brand;
MOQ: No;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Customers Brand;
MOQ: No;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Customers Brand;
MOQ: No;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
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