Fr-4 Montaje De Circuitos Electronicos Montaje De Circuito Impreso Montaje De Placa PCB Tarjeta PCB pictures & photos

Fr-4 Montaje De Circuitos Electronicos Montaje De Circuito Impreso Montaje De Placa PCB Tarjeta PCB

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$5.00-25.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Jc
Transport Package High Quality Carton Box Outside with Bubble Bag in
Specification customized
Trademark JC
Origin Shenzhen, China

Product Description

PRODUCT DESCRIPTION Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers Board thickness 0.1 to 6.0mm(4 to 240mil) Minimum line width/space 0.076/0.076mm ...

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Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Business Type Manufacturer/Factory
Business Range Construction & Decoration, Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Instruments & Meters, Light Industry & Daily Use, Lights & Lighting, Manufacturing & Processing Machinery, Metallurgy, Mineral & Energy
Main Products Industrial Wire Harness, Automatic Wire Harness, Medical Wire Harness, Electrical Cabinet-Group, PCBA-Group, Mechanical Fabrication-Group, Smart POS Terminal-Group, Table POS, Ice Maker-Group, Kiosk-Group
Management System Certification ISO 9001, IATF16949

Montaje De PCB Comparison

	Fr-4 Montaje De Circuitos Electronicos Montaje De Circuito Impreso Montaje De Placa PCB Tarjeta PCB Contact Now	Quick View Professional ISO9001 ISO13485 IATF16949 Certified PCB PCBA Assembly Manufacturer Contact Now	Quick View OEM PCB and PCBA Assembly for Industrial Control Product Contact Now	Quick View Multilayers Printed Circuit Board SMT DIP Technology Custom Chip Decryption Design PCBA Assembly Service Contact Now	Quick View OEM Printed Circuit Board SMT & DIP PCB Assembly Contact Now

Transaction Info
	Fr-4 Montaje De Circuitos Electronicos Montaje De Circuito Impreso Montaje De Placa PCB Tarjeta PCB Contact Now	Quick View Professional ISO9001 ISO13485 IATF16949 Certified PCB PCBA Assembly Manufacturer Contact Now	Quick View OEM PCB and PCBA Assembly for Industrial Control Product Contact Now	Quick View Multilayers Printed Circuit Board SMT DIP Technology Custom Chip Decryption Design PCBA Assembly Service Contact Now	Quick View OEM Printed Circuit Board SMT & DIP PCB Assembly Contact Now
Price	US $ 5.00-25.00/ Piece	US $ 1.03-6.00/ Piece	US $ 0.15-10.00/ Piece	US $ 1.02-6.00/ Piece	US $ 0.67-5.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T	T/T, Paypal, Money Gram	T/T	T/T, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Jc;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzhen Jia Cheng Electric Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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