Power Monitoring Circuit Board
US$0.44-0.45 / Piece
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What is 6-Layer Circuit Board with Advanced High-Frequency Technology

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$0.45

1,000+ Pieces US$0.44

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 30*80mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig

Product Description

Specifications: Layers: 6 Thickness: 0.6-1.6mm Material: FR4 KB6160 Size: 28*110mm Surface treatment: HASL Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: ENIG Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, the ...

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Power Monitoring Circuit Board Comparison
Transaction Info
Price US $ 0.44-0.45/ Piece US $ 2.36-7.89/ Piece US $ 2.54-8.12/ Piece US $ 3.15-8.98/ Piece US $ 2.60-10.00/ Piece
Min Order 10 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Multilayer Rigid PCB;
Dielectric: Fr4 Em825 1.0mm;
Material: Epoxy Paper Laminate;
Application: Telecom;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6layer HDI PCB 2+N+2;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: Multilayer Rigid PCB;
Dielectric: Fr4 Em825 0.8/1.0mm;
Material: Epoxy Paper Laminate;
Application: Telecom;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold+OSP;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 8layer HDI PCB 2+N+2;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Blind/Buried Vias: 0.1mm Laser Drilling;
Structure: Multilayer Rigid PCB;
Material: Epoxy Paper Laminate;
Flame Retardant Properties: V0;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 8layer HDI PCB 2+N+2;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Blind/Buried Vias: 0.1mm Laser Drilling;
Min. Hole Wall: 20um Cu;
Structure: Metal Base Rigid PCB;
Dielectric: Al;
Material: Metal Material;
Application: LED Light;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: 1;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier