Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
|
Structure: Single-Sided Rigid PCB;
Dielectric: CEM-1;
Material: Polyester Glass Fiber Mat Laminate;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Solder Mask: White;
Silk Screen: Green, White;
Surfaceing Finish: Enig, HASL, OSP;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min Hole Size: 0.2mm;
Min Line Spacing: 0.1mm;
Min Line Width: 0.1mm;
Package: Vacuum;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: Hal, HASL Lead Free, Immersion Gold, G;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min.Line Wigth: 0.2mm;
Min. Line Spacing: 0.2mm;
Layer: 1 to 24;
Solder Mask: Green,Blue,Ect;
Legend Mask: White;
|
Structure: Multilayer Rigid PCB;
Dielectric: CEM-1;
Material: Polyester Glass Fiber Mat Laminate;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
PCB Solder Mask: White;
PCB Silkscreen: Black;
PCB Board Thickness: 1.6mm;
PCB Surface Finishing: HASL;
Min Hole Size: 0.2mm;
Min Line: 0.2mm;
Size: 10-1000mm;
Delivery Time: 1-7days;
Pack: Vacuum Packing;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.3mm;
Min. Line Width: 0.2mm;
Min. Line Spacing: 0.2mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|