What is China PCB Board/PCB Assembly Apply for Electronic Products

Name: China PCB Board/PCB Assembly Apply for Electronic Products
Uploaded: 2023-08-04T11:09:00+08:00
Description: China PCB board/PCB assembly apply for electronic products WELCOME TO XJY--------------- Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 yea

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Fr4
Insulation Materials Organic Resin
Transport Package Vacuum Package
Specification Normal
Trademark XJY
Origin China
Surface Finishing Hal, HASL Lead Free, Immersion Gold, G
Copper Thickness 1oz
Board Thickness 1.6mm
Min. Hole Size 0.2mm
Min.Line Wigth 0.2mm
Min. Line Spacing 0.2mm
Layer 1 to 24
Solder Mask Green,Blue,Ect
Legend Mask White
Certificate UL,SGS,RoHS,ISO 9001

Product Description

China PCB board/PCB assembly apply for electronic products WELCOME TO XJY--------------- Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, ...

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Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products PCB, PCB Board, Aluminum PCB, FPC, PCBA, LED PCB, PCB Assembly, Printed Circuit Board, Rigid PCB, MCPCB
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Printed Circuit Board Comparison

	Quick View China PCB Board/PCB Assembly Apply for Electronic Products Contact Now	Quick View Medical Instruments V0 King Field/OEM Vacuum Packaging Ccl Sheet Circuit Board PCB Contact Now	Quick View ISO9001, ISO16949, RoHS V0 King Field/OEM Customized PCB Boards Circuit Board Contact Now	Quick View Epoxy Resin King Field/OEM Vacuum Packaging Fr4 Copper Clad Laminate PCB Board Contact Now	Quick View Multilayer Rigid Fr-4 King Field/OEM Vacuum Packaging Aluminium PCB Board Contact Now

Transaction Info
	Quick View China PCB Board/PCB Assembly Apply for Electronic Products Contact Now	Quick View Medical Instruments V0 King Field/OEM Vacuum Packaging Ccl Sheet Circuit Board PCB Contact Now	Quick View ISO9001, ISO16949, RoHS V0 King Field/OEM Customized PCB Boards Circuit Board Contact Now	Quick View Epoxy Resin King Field/OEM Vacuum Packaging Fr4 Copper Clad Laminate PCB Board Contact Now	Quick View Multilayer Rigid Fr-4 King Field/OEM Vacuum Packaging Aluminium PCB Board Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	UL,SGS,RoHS,ISO 9001	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Surface Finishing: Hal, HASL Lead Free, Immersion Gold, G; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.2mm; Min.Line Wigth: 0.2mm; Min. Line Spacing: 0.2mm; Layer: 1 to 24; Solder Mask: Green,Blue,Ect; Legend Mask: White;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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