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US$1.50-4.50 / Piece

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PCBA PCB Assembly Printed Circuit Boards New Energy PCB pictures & photos

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What is PCBA PCB Assembly Printed Circuit Boards New Energy PCB

Name: PCBA PCB Assembly Printed Circuit Boards New Energy PCB
Uploaded: 2024-01-09T09:53:58+08:00
Description: Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Direc

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About this Item

Price

Purchase Qty. Reference FOB Price

10-499 Pieces US$4.50

500-999 Pieces US$4.00

1,000-4,999 Pieces US$3.50

5,000+ Pieces US$1.50

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxide Woven Glass Fabric Laminate
Application Consumer Electronics
Flame Retardant Properties HB
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand Jxpcba
Transport Package ESD Bag+Bubble Wrapped +Carton
Specification customized PCBA
Trademark jxpcba
Origin China
Layer 1-32 Layers
Board Thickness 0.2-8.0mm
PCB Testing PCB: Ict Testing and Flying Probe Testing
PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
Qualified Ipc-a-610cclass 2 Standard
Thick Copper 18um-140um(4oz)
Service OEM/ODM, EMS
PCB Materials Fr4
PCB Soldermask Green
PCB Silkscreen White
PCB Tg Tg170
IC Qfn
IC Type BGA
SMT 01005
PCBA Testing Function Testing 100%

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: 0.5-5oz ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

PCBA Comparison

	PCBA PCB Assembly Printed Circuit Boards New Energy PCB Contact Now	Quick View Xpc High Quality Copper Clad Sheet Contact Now	High Density HDI Multilayer PCB Custom Circuit Board Manufacturer Multilayer Design Fr4 Rigid-Flex PCB Contact Now	Rigid Double-Layers Fr4 Circuit Board Electronic Circuit Manufacturer PCBA EMS PCB Contact Now	RoHS Custom Quick Turn Electronic Circuit Board Manufacturer PCBA Rigid Flexible PCB EMS PCB Contact Now

Transaction Info
	PCBA PCB Assembly Printed Circuit Boards New Energy PCB Contact Now	Quick View Xpc High Quality Copper Clad Sheet Contact Now	High Density HDI Multilayer PCB Custom Circuit Board Manufacturer Multilayer Design Fr4 Rigid-Flex PCB Contact Now	Rigid Double-Layers Fr4 Circuit Board Electronic Circuit Manufacturer PCBA EMS PCB Contact Now	RoHS Custom Quick Turn Electronic Circuit Board Manufacturer PCBA Rigid Flexible PCB EMS PCB Contact Now
Price	US $ 1.50-4.50/ Piece	US $ 16.00-30.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-1.00/ Piece
Min Order	10 Pieces	1000 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order	L/C, T/T	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$1 Million - US$2.5 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM, IMS service	OEM	OEM	OEM	OEM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Consumer Electronics; Flame Retardant Properties: HB; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Jxpcba; Layer: 1-32 Layers; Board Thickness: 0.2-8.0mm; PCB Testing: PCB: Ict Testing and Flying Probe Testing; PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop; Qualified: Ipc-a-610cclass 2 Standard; Thick Copper: 18um-140um(4oz); Service: OEM/ODM, EMS; PCB Materials: Fr4; PCB Soldermask: Green; PCB Silkscreen: White; PCB Tg: Tg170; IC: Qfn; IC Type: BGA; SMT: 01005; PCBA Testing: Function Testing 100%;	Structure: Metal Base Rigid PCB; Dielectric: Al; Material: Al; Application: PCB; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Hfi; Size: 10202040;*	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Abis; Copper Thickness: 2 Oz; Board Layer: 1-20 Layers; Board Thickness: 1.6mm; Surface Finish: Gold Plating, Enig; Solder Mask: Green/Custom; Legend: White;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.0mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold/Customized; Solder Mask: Blue; Legend: White/Customized; Layer: Multi-Layer;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Abis; Copper Thickness: 1 Oz; Board Layer: 1-20 Layers; Board Thickness: 1.6mm; Surface Finish: Gold Plating, Enig; Solder Mask: Green/Custom; Legend: White;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Hainan Fuwang Industrial Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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