Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Solder Color: Red, Green, Black, White, Blue, Other;
Surface Finish: HASL, Enig, OSP, Tin, Other;
Thickness: 0.8mm, 0.4mm, 1.6mm, Other;
Layer Thickness: 0.5oz, 1oz, 1.5oz, Max 6oz;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Solder Color: Red, Green, Black, White, Blue, Other;
Surface Finish: HASL, Enig, OSP, Tin, Other;
Thickness: 0.8mm, 0.4mm, 1.6mm, Other;
Layer Thickness: 0.5oz, 1oz, 1.5oz, Max 6oz;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 2 Layer;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating, Enig;
Solder Mask: Green/Custom;
Legend: White;
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