| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
MOQ: 1 PCS;
Quality: High Quality;
Service: One-Stop Service;
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Structure: Single/Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Fiber Galss Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0, V1;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.05-3.5mm;
Copper Thickness: 18um, 35um, 105um, Others;
Color: Yellow;
Market: Euro, Asia, Central and South America;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Surface Finish: Immersion Gold;
Solder Mask: Green;
Legend: White/Customized;
Layer: 4/6/8 Layer;
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Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customers Brand;
Surface Treatment: Gold Finger/Hard Gold;
Test: 100% E-Test;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Spacing: 0.10mm(4mil);
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Board Thickness: 0.2-6mm;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Min. Line Width: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Delivery: 7 Days;
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