Circuit Board
US$0.95-2.10 / Piece
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1.5mil Copper King Field/OEM Vacuum Packaging 100*585 Circuit Board PCB Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$2.10

1,000-9,999 Pieces US$1.10

10,000+ Pieces US$0.95

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxide Woven Glass Fabric Laminate
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Packaging
  • Specification 100*585
  • Trademark KING FIELD/OEM
  • Origin China
  • Certificate ISO9001, ISO16949, RoHS
  • Surface Treatment OSP, Immersion Gold, Immersion Tin, Immersion AG
  • Impedance Control Accuracy ±8%
  • Minimum Solder Resist Opening 1.5mil

Product Description

Quick response, will reply Customer's any enquiry within 1 hours -24 hours technique Support. -24 hours Engineering Gerber files treatment. -24 hours English Engineering Questions Confirmation by E-mail. -ExperiencedImpedance Designer. -Supply the best project fit for production customized. ...

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Circuit Board Comparison
Transaction Info
Price US $ 0.95-2.10/ Piece US $ 0.01-150.00/ Piece US $ 0.01-100.00/ Piece US $ 0.10-20.00/ Piece US $ 0.01-200.00/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal, 30 days net T/T, Western Union, Paypal
Quality Control
Product Certification ISO9001, ISO16949, RoHS - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Double-Sided Rigid PCB;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Structure: Single-Sided Rigid PCB;
Dielectric: Aluminum Base Board;
Material: Aluminum Base Board;
Application: LED Light;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Other Material: Rogers, Pi, Al, etc;
Max Copper: 6oz;
Layer: 1L-22L;
Max Thickness: 6mm;
Finished: Enig, HASL, OSP, Lf-Hal, etc;
Structure: Double-Sided Rigid PCB;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Cooper Thickness: 2 Oz;
Board Thickness: 2.0 mm;
Materil: Metal Core;
Supplier Name

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier