Half Hole PCB, Multilayer PCB, HDI PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$12.50-15.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology HASL Lead-Free
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Not Specified
  • Transport Package by Vacuum Packing in Cartons
  • Trademark KMC
  • Origin Shengzhen Guangdong
  • Material Type Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger
  • Layer Counts 1--30
  • Board Thickness 0.2mm--6.0mm
  • Fished Outer Copper 1oz--5oz
  • Minimum Trace Width 3mil/4mil
  • Surface Treatment Type HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;

Product Description

Product De Basic Info Type: Rigid Circuit Board Dielectric: FR-4 Flame Retardant Properties: V0 Mechanical Rigid: Rigid Insulation Materials: Epoxy Resin Brand: Kb ,Shengyi,Ilm Min. Hole Size: 0.2mm Min. Line Width&Spacing: 0.1mm/0.1mm Certificates: UL, RoHS, SGS, ISO9001 ISO14000 ...

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Half Holes PCB Comparison
Transaction Info
Price US $ 12.50-15.00/ Piece US $ 0.1/ PCS US $ 0.01-1.00/ Piece US $ 0.1/ PCS US $ 1.90-2.60/ PCS
Min Order 1 Pieces 1 PCS 1 Pieces 1 PCS 1 PCS
Trade Terms - FOB, DAT, DDP, EXW FOB, DDP, DAP FOB, DAT, DDP, EXW FOB, DAT, DDP, DAP, CIP, CPT, EXW
Payment Terms L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union L/C, T/T L/C, T/T, Western Union L/C, T/T, D/P, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, Own Brand OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3mil/4mil;
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 2.0mm;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer: 8;
Thickness: 1.5mm;
Mmodel: Xceh;
Rogers: R03006;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.6mm;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Uc;
Surface Finihsing: HASL-Lf;
Board Layer: 4 Layers;
Lead Time: 6 Working Days;
Supplier Name

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier